HOW TO – Breadboard breakout for leadless chips

Technology

Collin Cunningham

January 19th, 2009 2

Here’s an interesting strategy for accessing the tiny pin contacts on no-lead QFN chips using temperature resistant tape and a conductive pen. Starlino’s example intentionally bridges several pins but theoretically should work for accessing all of them individually (considerable patience required, of course)
– Reverse Surface Mounting of small leadless SMD components [via Curious Inventor]

2 thoughts on “HOW TO – Breadboard breakout for leadless chips”

Max 'shoez' Kingsbury says:

January 19th, 2009 at 9:49 am

I’ve heard these boards are good for beginning solderers. They have boards where the pin pads are recessed so that the pins “pop” in place and can’t be askew. I think the QFN package boards are designed with extra long pads so that they can be easily “het” up using a large soldering iron. Once the solder is warm, its surface tension pulls the part into place.

http://www.schmartboard.com/index.asp?page=products_csp