Make It Last Build Series: the third newsletter is out!

Make It Last Build Series: the third newsletter is out!

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We’re already into our third week of the Make It Last build series, and things are starting to heat up- literally! If you’re wondering why we might be boiling a semiconductor chip, then you should check out the latest newsletter, where we explain why one might need to both boil and freeze their components.

Just getting started with the contest? Here are some handy links.

Sign up for the newsletter:





Get up to speed by reading the back issues of the Make It Last Newsletter:

Check out the cool prizes:

  • Grand Prize: MPLAB® ICD 3 In-Circuit Debugger, Explorer 16 Demo Board, F1 Evaluation Platform, MPLAB® Starter Kit for PIC24F, MCP1640 Single Cell Boost Converter for Energizer® MAX AlkalineAAAA, Energizer® Night Strike Swivel Light, $50 Maker ShedGift Certificate
  • Second Prize: F1 Evaluation Kit, MPLAB® Starter Kit for PIC18F MCU, MCP1640 Single Cell Boost Converter for Energizer® MAX AlkalineAAAA, Energizer® Night Strike Swivel Light

And head over to the contest landing page for contest updates and details.

What will the next generation of Make: look like? We’re inviting you to shape the future by investing in Make:. By becoming an investor, you help decide what’s next. The future of Make: is in your hands. Learn More.

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