Good how to on surface mounting with hand-soldering tools. “Integrated-circuit (IC) manufacturers produce fewer new designs in dual in-line package (DIP), shrink dual in-line package (SDIP), or other through-hole forms. These are the classic looking chips that have legs that extend through the circuit board and are soldered on the other side. They’re easy to put into sockets and easy to use on solderless breadboards. Most of the new families appear only in surface-mount technology (SMT), surface mount device (Philips SMD), or surface mount component (SMC) packaging such as small outline integrated circuit (SOIC), small outline J-leaded (SOJ), small outline transistor (SOT), plastic leaded chip carrier (PLCC), quad flat pack (QFP), or thin small outline package (TSOP). Without special adapter (carrier) boards, surface-mounted components make breadboarding and hobbyist experimentation difficult.” Thanks Greg! Link.