Technology

HOW TO – Write iSync Phone Plugins

HOW TO – Write iSync Phone Plugins

SyncGreat article on making iSync phone plugins from The Tao of Mac “Given that there seems to be a lot of misconceptions about exactly how iSync detects and understands the capabilities of mobile phones and pretty much no written documentation about the whole process, I thought it was about time I published my notes on the matter.” Brian reminded me that you can use’screen’ to talk to serial ports (for example, ‘screen /dev/tty.Bluetooth-Modem’), so you don’t need ZTerm to do this…Link.

HOW TO – Portable NES in a GameGear

HOW TO – Portable NES in a GameGear

Mega1Leadingzero writes “Inspired by Ladyada’s infamous GameGrrl, I recently became determined to make my own portable NES out of the MegaJoy (one of those knockoff Nintendo systems that can be found in malls) and the recently discontinued HIP Gear Screen pad. However, for my project I wanted to do something slightly different. I wanted to give mine a more unique feel, so when I recently found my old Sega GameGear I instantly knew that it was destined for this project.” Link.

Run Minix 3.0 under Virtual PC

Run Minix 3.0 under Virtual PC

Minix303T“The original Minix was an educational operating system – that actually served as the inspiration for development of Linux. MINIX 3 is a new open-source operating system designed to be highly reliable and secure. It is based somewhat on previous versions of MINIX, but is fundamentally different in many key ways. MINIX 1 and 2 were intended as teaching tools; MINIX 3 adds the new goal of being usable as a serious system on resource-limited and embedded computers and for applications requiring high reliability.” One of the nice things about Minix 3.0 is that unlike previous versions of Minix – it installs and runs just fine inside of Virtual PC. Thanks Brian! Link.

Surface mounting with hand-soldering tools

Surface mounting with hand-soldering tools

Pcb3SolderpasteGood how to on surface mounting with hand-soldering tools. “Integrated-circuit (IC) manufacturers produce fewer new designs in dual in-line package (DIP), shrink dual in-line package (SDIP), or other through-hole forms. These are the classic looking chips that have legs that extend through the circuit board and are soldered on the other side. They’re easy to put into sockets and easy to use on solderless breadboards. Most of the new families appear only in surface-mount technology (SMT), surface mount device (Philips SMD), or surface mount component (SMC) packaging such as small outline integrated circuit (SOIC), small outline J-leaded (SOJ), small outline transistor (SOT), plastic leaded chip carrier (PLCC), quad flat pack (QFP), or thin small outline package (TSOP). Without special adapter (carrier) boards, surface-mounted components make breadboarding and hobbyist experimentation difficult.” Thanks Greg! Link.